Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique

Wafer Level Surface Activated Bonding Tool for MEMS Packaging

A wafer level surface activated bonding ~SAB! tool has been developed for microelectromechanical systems ~MEMS! packaging at low temperature. The tool accommodates 8 in. diam wafers. The principle features of the tool are the automatic parallel adjustment for 8 in. wafers to a margin of error within 61 mm and the X, Y, and u axis alignments with an accuracy of 60.5 mm. We have approached a new ...

Wafer-Level Vacuum Packaging of Smart Sensors

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors-"low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, we can further greatly reduce the cost of sensor components and systems as well as further decreas...

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

Wafer Level Packaging Using High Force Bonding of Alge

Design Rules for Wafer Level Packaging of MEMS, CMOS-MEMS Integration, and Smart Systems using Anodic Bonding and Lateral Feedthroughs

The advantages of wafer level packaging (WLP) are widely recognized across a range of applications MEMS, IC’s Smart systems, CMOS-MEMS integration, System on Chip (SoC), Package in Package (PiP), Package on Package (PoP ) etc. Key benefits include true chip-size package, reduced cost of interconnects (by creating at wafer-level rather than back-end chip-scale packaging), and minimising test and...